- REPLACEMENT FROM CERAMIC PCBs ENABLES THE COST REDUCTION
- REPLACEMENT FROM WATER-COOLED TO AIR-COOLED ENABLES THE UNIT COST REDUCTION
- REDUCTION OF HEAT SINK SIZE AND UNIT SIZE
- LOWER JUNCTION TEMPERATURE ENABLES THE LONGR LIFE OF THE UNIT
HEAT RADIATION PERFORMANCES – COMPARISON OF DPGA AND OTHERS –
HERE BELOW IS THE TESTING RESULT OF HEAT RADIATION
【CONDITIONS OF TESTING】
LED : REBEL (PHILIPS LUMILEDS)
WATTAGE : 3.4W
TEMPERATURE : 45MIN. AFTER TURNING THE LED ON (Celsius)
RESULT
| DPGA PCBs | ALUMINUM PCB | HEAT CONDUCTION CEM3 | FR-4 | |
|---|---|---|---|---|
| INITIAL TEMPERATURE | 22 | 22 | 22 | 22 |
| 45MIN. AFTER TURNING THE POWER ON(DEGREES CELSIUS) | 47 | 61 | 111.5 | 132.5 |
| TEMPERATURE RISE (DEGREES CELSIUS) | 25 | 39 | 89.5 | 110.5 |
| THERMOGRAPHY AFTER 45MIN. |
|
|
|
|
DPGA PCBs
- INITIAL TEMPERATURE
- 45MIN. AFTER TURNING THE POWER ON(DEGREES CELSIUS)
- TEMPERATURE RISE (DEGREES CELSIUS)
- THERMOGRAPHY AFTER 45MIN.
ALUMINUM PCB
- INITIAL TEMPERATURE
- 45MIN. AFTER TURNING THE POWER ON(DEGREES CELSIUS)
- TEMPERATURE RISE (DEGREES CELSIUS)
- THERMOGRAPHY AFTER 45MIN.
HEAT CONDUCTION CEM3
- INITIAL TEMPERATURE
- 45MIN. AFTER TURNING THE POWER ON(DEGREES CELSIUS)
- TEMPERATURE RISE (DEGREES CELSIUS)
- THERMOGRAPHY AFTER 45MIN.
FR-4
- INITIAL TEMPERATURE
- 45MIN. AFTER TURNING THE POWER ON(DEGREES CELSIUS)
- TEMPERATURE RISE (DEGREES CELSIUS)
- THERMOGRAPHY AFTER 45MIN.
TENPERATURE RISE
（CLICK TO ENLARGE）
LESS THAN ONE THIRD OF RISE COMPARED WITH HEAT CONDUCTION CEM3
THEREFORE, ADVANTAGES BELOW CAN BE EXPECTED
HIGH RADIATION OF PCB ITSELF CAN :- REDUCTION OF HEAT SINK SIZE. LOWERING OF JUNCTION TEMPERATURE. HIGHER LUMINANCE AND LONGER LIFE.
REDUCTION OF HEAT SINK SIZE AND UNIT SIZE
THE CAPACITY CAN BE 44% USING DPGA
IN CASE THE LED TEMPERATURE IS 74 DEGREES CELSIUS
UNIT CAPACITY WITH DPGA PCB=32 CUBIC CENTIMETERS
UNIT CAPACITY WITH ALMINUM PCB=72 CUBIC CENTIMETERS
| PCB/UNIT CAPACITY | 18 CUBIC CENTIMETERS | 32 CUBIC CENTIMETERS | 50 CUBIC CENTIMETERS | 72 CUBIC CENTIMETERS |
|---|---|---|---|---|
| DPGA | 82 DEGREES CELSIUS | 73.4 DEGREES CELSIUS | 67.5 DEGREES CELSIUS | 64.7 DEGREES CELSIUS |
| ALUMINUM PCB | 95.7 DEGREES CELSIUS | 88 DEGREES CELSIUS | 80 DEGREES CELSIUS | 74.4 DEGREES CELSIUS |
| DIFFERENCE | 13.7 DEGREES CELSIUS | 14.6 DEGREES CELSIUS | 12.5 DEGREES CELSIUS | 9.5 DEGREES CELSIUS |
UNIT CAPACITY : 18 CUBIC CENTIMETERS
- DPGA
- 82 DEGREES CELSIUS
- ALUMINUM PCB
- 95.7 DEGREES CELSIUS
- DIFFERENCE
- 13.7 DEGREES CELSIUS
UNIT CAPACITY : 32 CUBIC CENTIMETERS
- DPGA
- 73.4 DEGREES CELSIUS
- ALUMINUM PCB
- 88 DEGREES CELSIUS
- DIFFERENCE
- 14.6 DEGREES CELSIUS
UNIT CAPACITY : 50 CUBIC CENTIMETERS
- DPGA
- 67.5 DEGREES CELSIUS
- ALUMINUM PCB
- 80 DEGREES CELSIUS
- DIFFERENCE
- 12.5 DEGREES CELSIUS
UNIT CAPACITY : 72 CUBIC CENTIMETERS
- DPGA
- 64.7 DEGREES CELSIUS
- ALUMINUM PCB
- 74.4 DEGREES CELSIUS
- DIFFERENCE
- 9.5 DEGREES CELSIUS
ARCHITECTURE AND FEATURES OF PATENTED DPGA PROCESS
THE DPGA STANDS FOR DAIWA PROCESS GLOVAL ADVANCE. THIS IS OUR OWN UNIQUE PROCESS THAT CAN ENABLE THE DIRECT CONNECTION TO COPPER BASES.
THE ARCHITECTURE THAT ENABLES THE HIGH HEAT RADIATION CAPABILITY (EXAMPLE WITH HIGH LUMINANCE LED)
DIRECT CONNECTION OF HEAT RADIATION PAD AND COPPER BASE VIA COPPER BUMP
HEAT CONDUCTION OF COPPER ENABLES THE HIGH HEAT RADIATION OF LED
ARCHITECTURE DIFFERENCE
DIRECT CONNECTION OF DPGA IS THE BIGGEST DIFFERENCE FROM ALLUMINAM OR CEM3 PCBs
| DPGA PCBs | ALUMINUM PCB | HIGH CONDUCTION CEM3 OR FR-4 |
|---|---|---|
|
|
|
- DPGA PCBs
- ALUMINUM PCB
VARIATIONS IN ACCORDANCE WITH R&D NECESSITY
MULTI LAYERS ON METAL BASE
INSSULATION WITH SEPARATED COPPER BASE
REPLACEMENT OF CERAMIC BASED PCBs
COPPER PIN IN-LAY
CHIPS CAN BE MOUNTED ON BOTH SURFACES
PIN-POINT RADIATION OF HEAT RADIATION DEVICE
AS THIS IS NOT PRESS-FIT OF COPPER PINS, THERE IS NO CONCERNS ABOUT CRACKS OR REMAINING TOXIC
CONSULTATIONS OF COPPER PIN SIZE AND SHAPE IS POSSIBLE
FIVE FEATURES OF DPGA
- DIRECT CONNECTION ENABLES HIGH HEAT RADIATION AND HIGH CONNECTION RELIABILITY
- VARIOUS SIZES AND SHAPES COPPER BUMPS CAN BE CREATED
- MIXTURE OF DIFFERENT SIZE/SHAPED OF BUMPS IN ONE PCB IS POSSIBLE
- THIN, LIGHT WEIGHT AND STIFFNESS OF THE PCB
- MOST SUITABLE FOR LEDS AND IN-VHICLE PCBs
METAL BASED PCBs
WE CAN MANUFACTURE AUTHENTIC ALUMINUM OR COPPER BASED PCBs
THE HEAT CONDUCTION PERFORMANCE UPTO 10W
HIGH VOLTAGE PCBs(THICK COPPER)
THE THICK CUPPER CAN BE USED FOR BOTH SURFACE AND/OR INNER LAYERS
