GREETINGS FROM PRESIDENT
OUR COMPANY STARTED OUR BISUNESS AS A DIE PRESSING FACTORY IN 1967. WE TRANSFERRED OUR TECHNOLOGY TO EXTERNAL CUTTING OF PCB AND STARTED MANUFACTURING PCBs FROM 1982.
WITH OUR COMPANY POLICY “MAKE ALL THE RELATED PEOPLE AND PARTIES HAPPY”, WE DO OUR BUSSINESS CONSIDERING EXCITEMENT AND SATISFACTION OF OUR CUSTOMERS, EMPLOYEES, THEIR FAMILIES AND LOCAL PEOPLE IN THIS AREA.
THE ENVIRONMENTAL CHANGE IS SO RAPID WORLD-WIDE. BUT WE WILL CONTINUE TO SUPPLY EXCITEMENT AND SATISFACTION STANDING ON THE WORLD LEADING MANUFACTURING TECHNOLOGY AND INNOVATION.
THE TECHNICAL INNOVATIONS IN COMPUTER CHIPS ARE SO RAPID NOW. BUT OUR INDUTRY IS ALSO FACING HEAT PROBLEM. WE SUCCEEDED TO MANUFACTURE AUTHENTIC PCBs THAT HAS SAME HEAT RADIATION CAPABILITY AS CERAMIC PCBs.
OUR MANUFACTURING AND INNOVATION CAN BE ACHIVED WITH CHALLENGES OF OUR EMPLOYEES. WE CONTINUE TO CHALLENGE WITH OUR POLICY “KEEP PROMISES, KEEP STEPPING FORWARD FOR BIG GOALS”.
DAIWA CORPORATION
President Eiji Yoshimura
COMPANY PROFILE
COMPANY NAME | DAIWA CO., LTD. |
PRESIDENT | EIJI YOSHIMURA |
ADDRESS | 394-0004, 4-1-25, SHINMEI-CHO, OKAYA-SHI, NAGANO PREF. JAPAN |
TEL | +81-266-22-5758 |
FAX | +81-266-23-7324 |
CAPITAL MOUNT | JPY 95,000,000 |
NUMBER OF EMPLOYEES | 73 |
ANNUAL SALES | JPY 1,190,000000 |
OUR BUSIESS | DEVELOPMENT, PRODUCTION AND SALES OF PRINTED CIRCUIT BOARDS |
ISO ACQUISITION | 9001(2015 VER.) AND 14001 (2015 VER.) |
COMPANY HISTORY
DEC. 1967 | COMPANY FOUNDATION AND STARTED DIE PRESS BUSINESS |
AUG. 1982 | STARTED PCB MANUFACTURING |
DEC. 1988 | INSTALLED MULTI-LAYER PRESS MACHINE AND STARTED SELF MANUACTURING OF MULTI LAYERED PCBs |
DEC. 1992 | STARTED MANUFCACTURING BUILD-UP PCBs |
OCT. 1996 | MAS-PRODUCTION OF BUILD-UP PCBs |
JUN. 1998 | NEW METHOD OF BUILD-UP PCBs CALLED "AGSP" WAS STAETED |
NOV. 2000 | ACQUIRED ISO 9002 |
ARP. 2001 | ACQUIRED INTERNATIONAL PATENT OF NEW BUILD-UP "AGSP" |
JUN. 2003 | ACQUIRED ISO 9001(2000 VER.) |
JUN. 2007 | ESTABLISHED DENKA AGSP COMPANY IN JOINT WITH DENKI KAGAKU KOGYO CO. LTD. |
NOV. 2008 | ACQUIRED ISO 14001(2004 VER.) |
MAY 2011 | SUCESSFULLY DEVELOPPED HIGH RADIATION PSB "DPGA" Daiwa Process Global Advance |
APR. 2012 | CHANGED NAME OF "DENKA AGSP" TO DAIWA CORPORATION |
MAY 2015 | EXPANEDED NC DRILLING FACILITIES |
MAY 2016 | SUCCESSFULLY DEVELOPPED "DPGA-M" AND "DPGA-S", THE HIGH RADIATION WITH CONTINUITY CUIRCUTS |
JUL. 2016 | INSTALLED THE DIRECT IMAGING MACHINE FOR CUIRCUIT CREATION |
FEB. 2017 | APPLICATION OF INTERNATIONAL PATENT FOR "DPGA" IS SUBMITTED |
MAY 2017 | SUCCESSFULLY DEVELOPPED "DPGA-EF", THE COPPER INLAY PCB |
SEPT. 2017 | ACQUIRED ISO 9001 (2015 VER.) |
NOV. 2017 | ACQUIRED ISO 14001(2015 VER.) |
DEC. 2017 | STARTED MAS-PRODUCTION OF HIGH RADIATION PCB "DPGA" |
MAR. 2018 | ABSORBED DAIWA CORPORATION |
MAY 2018 | INSTALLED AUTO EXPOSURE MACHINE OF SOLDER RESIST AND INK-JET SILK PRINTING MACHINE |
JUN. 2018 | INSTALLED AUTO CUT SAW AND FULL AUTOMTIC PROBE CHECKER |
JUN. 2019 | INSTALLED FULL AUTOMATIC NC DRILLING MACHINE |
JUL. 2021 | INSTALLED FULL AUTOMATIC PROBE CHECKER (2ND UNIT) |
MAR. 2023 | SUCCESSFULLY DEVELOPPED "DPGA-AIN", THE PCB WITH INSULATTED RADIATION PINS |